We have diverse treatments in place to protect against environmental influences or unauthorized access, with which products are coated or sealed in line with the requirements.
Compound in hot melt - low pressure method
This compound technique is a procedure for processing thermoplastic, polyamide-based hot melts as a granulate. The granulate is melted and, using a low pressure method, injected into a tool molding, in which the electronic module has already been fixed. To protect the components low pressure from 2 bar upwards is used. The processing temperature is momentarily approx. 200 °C. The injection molding tools are generally made of aluminum and can be produced quickly and cost-effectively using an inexpensive procedure.
Compound in the potting procedure
Sealing compounds containing one or two components are dosed and poured into the housing using a valve. These compounds can range from soft-flexible to high strength, filled or unfilled, transparent or colored. Depending on the requirement, we use cold and warm hardening compounds with different chemical compositions: epoxide resin, polyurethane, silicone and ceramic sealing compounds.