IPF field service conference
A fixed date in ipf electronic's annual calendar of events is the field service conference, which always takes place in September.
After welcoming the 24 participants to the two-day event, Managing Director Christian Fiebach presented the current sales strategy and emphasized, among other things, the features of the current challenges for both ipf electronic and the company's customers. For example, ipf electronic wants to continue to position itself as a successful supplier of special sensor solutions, as there is a great need in the market for developments for specific applications in which very special and often very high requirements cannot be met with standard sensor technology. ipf electronic has launched some interesting new developments in this area in recent years, which have attracted a lot of attention in a wide variety of industrial sectors.
Another straightforward topic at every field service conference is how the work of sales staff and application specialists can be supported in a targeted and sustainable manner. ipf electronic relies on the use of modern technologies such as artificial intelligence (AI).
Against this background, Alexander Kemler, Sales Manager for Germany, explained why AI is becoming increasingly important for ipf electronic and demonstrated with some practical examples how AI can be integrated into daily workflows, e.g. to significantly simplify and accelerate certain processes.
As we all know, nothing motivates more than success. At the end of the first day, application specialists Florin Finkbeiner, Ralf Henning, Dominik Jökel and Martin Kliment therefore presented successfully completed projects from their sales areas. They once again underlined the importance of a comprehensive technical understanding of applications to ensure that customers receive the best possible solution for their application.
The second day of the field service conference was dedicated to an innovation that ipf electronic will be presenting at the sps in Nuremberg in November. The application specialists had the opportunity to get to know the assembly concept of the new product in detail by assembling it with their own hands and then subjecting it to an end-of-line test. They also learned more about the technical basics, the operation and the special features of the new product with a view to its diverse potential, which is supported by numerous IO-Link functions, among other things.
It will be interesting to see what is actually behind this innovation.
