First IO-Link logic distributors from ipf: many freedoms for parameterization

ipf electronic presents for the first time the logic modules VL610304 and VL610308 with four and eight sensor inputs, respectively, which can be parameterized completely freely and thus very flexibly due to the IO-Link interface.

Logic modules logically link different sensor signals with each other (AND link or OR link). This is always useful if, for example, the digital signals of many sensors are to be processed on machines, but there are not enough inputs available on a controller. Up to now, however, several different logic distributors were always required for different logic operations, since they each have two outputs, regardless of the number of slots for the sensors (inputs). In the delivery state, the input signals at the outputs can be linked either only AND or only OR. The choice of logic and the associated tasks has therefore always been limited until now

Thanks to IO-Link, however, the new logic modules from ipf electronic can be parameterized very flexibly to meet the respective requirements. The result: The variety of variants otherwise required for the most diverse linking tasks is drastically reduced. For example, the inputs of the modules can now be linked independently of each other, which means that a single distributor enables both the free selection of the inputs and the logics required for them.

Another interesting feature is the creation of virtual groups with a single logic module. For example, certain slots can be combined in one group with a virtual AND operation, while the remaining slots are OR-linked in a second virtual group. The respective outputs of the groups then lead to a further common and freely selectable logic.  Up to now, three conventional logic distributors have been necessary for such configurations.

In addition, the new logic modules offer further advantages that are already known from IO-Link sensors, among others. These include fast and safe device replacement in the event of a defect since the IO-Link master can automatically transfer the already stored parameters of a defective device to the replacement module.

The new IO-Link logic modules impress with their greater flexibility of use in practice, significantly minimize the wiring effort, reduce warehousing, and save space during installation.