NEW AUTOMATED SYSTEM FOR PUR POTTING

Electronic devices are encapsulated in order to permanently

protect their electronic components from external influences

such as heat, moisture, vibration or shocks. To further optimize

this important production step, ipf electronic has put a new

encapsulation system into operation and opted for the proven

technologies of Dopag and Universal Robots.

 

Everything is fully automated to reduce the workload on

employees, with the robot taking over all recurring work steps.

This also means shorter production times, greater efficiency in

the process and optimized product quality - and therefore a real

win-win situation for everyone involved.

 

Only the relevant parts need to be provided for potting. To do

this, the robot removes a product carrier with these parts from a

stack, guides it to a camera for identification and measurement

and then to the dispensing head of the potting machine, which

fills the devices with the PUR potting compound in several steps.

 

The robot then forms new stacks with the processed product

carriers, in which the potting devices harden. This process can

also be carried out autonomously during a night shift. After a

short training period, the new system delivers fast and precise

results. With the help of the camera, the different variants of

the product family are recognized and encapsulated according

to their individual parameters.

 

For optimal integration of the system into the production

processes, the planning, design, essential parts of the

software, the programming of the robot and the assembly

were implemented by the in-house equipment construction

department. The knowledge gained here serves as the basis

for future expansions in this production step. ipf electronic is

proud of this further important step towards automation and

is looking forward to the potential that this will open up. (hma)

Further links

logic module VL310304

logic module VL310308

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